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BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone

BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone

$ 6.85

Availability: 42 in stock
  • application: Samsung HUAWEI HTC MTK Android
  • Restocking Fee: No
  • Refund will be given as: Money Back
  • Model Number: BGA Direct Heating Reballing Stenci
  • MPN: Does not apply
  • Usage: Home DIY
  • Item must be returned within: 30 Days
  • Type: Reballing Stencil
  • is_customized: No
  • Return shipping will be paid by: Buyer
  • Condition: New
  • All returns accepted: Returns Accepted
  • Material: Cast Iron
  • Brand: Unbranded

    Description

    PHONEFIX 12pcs Full Set BGA Reballing Stencil Template for Samsung Huawei MTK LG Xiaomi, Mobile Phone Rework Repair BGA Reballing Stencils soldering assistant, it is used for professional reballing operation on Samsung Huawei LG MTK Xiaomi Oppo Vivo BGA IC chips.